Assembly & Test Capabilities
 
Screen Print   Screen Print
  • Including vision system and angular squeegee printing, capable of printing at different angles
  • Solder paste height can be varied even within a single circuit board with changeable stencil thickness
  • Fine pitch capable to 16 mils

> play video

 

 

   
  Solder Paste Measurement
  • For missing & excess solder and solder bridges
  • To improve first-time yield, reduce rework and reduce customer PPM

Click image for larger view

 

 

   
Pick & Place Small   Pick & Place

Small Components

  • Capable of fine pitch and ultra-fine pitch to 0.4mm
  • 0.55 sec/shot for small chips
  • Placement accuracy +/- 0.000098 in.

Large Components

  • Components up to 74 x 74mm and heights of 10mm to 25.4mm

> play videos

 

 

   
Robotic Solder   Continuous, Double-sided SMT Processing with Automated Soldering
  • Including reflow and laser soldering
  • Selective wave soldering available for through-hole components

> play video

 

 

   
  Automatic Optical Inspection
  • To detect potential failure modes from components shifting, tombstoning or reversed
  • To detect solder bridges and correct solder fillet
  • Reduces customer PPM and reduces in-line inspection time

Click image for larger view

 

 

   
In-circuit Testing   In-circuit Testing
  • Designed for complex and heavily integrated circuit boards

> play video

 

 

   
Conformal Coat   Robotic Conformal Coat
  • To protect against moisture, chemicals and dirt
  • Applied selectively via robotic spray

> play video

 

 

   
Laser Depaneling   Laser Depanel
  • For improved precision and dust elimination
  • Available for circuit boards up to 18"

> play video

 

 

   
Complete Final Functional Test   Complete Final Functional Test
  • Experience with simulating a variety of customer applications, including displays, shifters, angle sensors and human interface modules

> play video